As an electronic materials manufacturer, SunRay Scientific develops novel electrical interconnection technology to make flexible electronics smaller, lighter, durable, and produced cost-effectively with greener technology. We generate revenue through material sales, licensing, and engineering services to electronics manufacturers, and through government contractors with major defense industry firms. We use a combination of direct sales and channel partner strategy to penetrate our target markets.

The predominate competitors are 3M Corporation (producer of anisotropic conductive films aka “ACF”), Indium Corporation (Indium Bump Bonding) and Low Temp Solder (Contract Manufacturer unique manufacturing technology: e.g., Molex). For the anisotropic conductive adhesives (ACA) interconnect solutions, competitors include Henkel, Alpha, Henkel, DuPont, Hitachi, Sun Chemical.  Although there are many competitors providing conductive adhesive solutions, such as the ones listed, all are limited in performance relative to SunRay’s ZTACH® ACE, which enables flexible electronics of which no other solution is capable due to the functionality, manufacturing, and cost. SunRay’s competitive advantages are: Time, technology protection through patents, and scalability. 1. Time – the production development timeline for electronics is several years. SunRay already has a pipeline of commercial products developed with strategic partners that are beginning to emerge successfully from the testing phase. No other competitor has a better solution that is commercial-ready. 2. Patents – SunRay technology includes material and process patents. 3. Scalability – SunRay has achieved production-ready scalable solutions available now.

SunRay generates revenue through material sales, licensing, and engineering services, using a combination of direct sales and channel partner market strategy.  Target customers include companies and government agencies (B2B, B2B2C, B2B2G) making printed circuitry or flexible electronic devices that need interconnections between circuits, microchips or other electrical devices. Our target market is flexible/wearable hybrid electronics, which includes wearable medical and diagnostic sensors, RFID tags, and flexible displays in healthcare, consumer electronics, automotive and defense/aerospace industries.

 

While the current focus is on flexible wearables, our technology is very applicable to semiconductor packaging, which is the next rung of our market penetration strategy. The customers we pursue in both industries are not limited by any geographic markets or other factors. Our technology has wide applicability across electronics manufacturing.